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 2N6027, 2N6028
Preferred Device
Programmable Unijunction Transistor
Programmable Unijunction Transistor Triggers
Designed to enable the engineer to "program'' unijunction characteristics such as RBB, , IV, and IP by merely selecting two resistor values. Application includes thyristor-trigger, oscillator, pulse and timing circuits. These devices may also be used in special thyristor applications due to the availability of an anode gate. Supplied in an inexpensive TO-92 plastic package for high-volume requirements, this package is readily adaptable for use in automatic insertion equipment. * Programmable -- RBB, , IV and IP * Low On-State Voltage -- 1.5 Volts Maximum @ IF = 50 mA * Low Gate to Anode Leakage Current -- 10 nA Maximum * High Peak Output Voltage -- 11 Volts Typical * Low Offset Voltage -- 0.35 Volt Typical (RG = 10 k ohms) * Device Marking: Logo, Device Type, e.g., 2N6027, Date Code
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating *Power Dissipation Derate Above 25C *DC Forward Anode Current Derate Above 25C *DC Gate Current Repetitive Peak Forward Current 100 s Pulse Width, 1% Duty Cycle *20 s Pulse Width, 1% Duty Cycle Non-Repetitive Peak Forward Current 10 s Pulse Width *Gate to Cathode Forward Voltage *Gate to Cathode Reverse Voltage *Gate to Anode Reverse Voltage *Anode to Cathode Voltage(1) Operating Junction Temperature Range *Storage Temperature Range *Indicates JEDEC Registered Data (1) Anode positive, RGA = 1000 ohms Anode negative, RGA = open Symbol PF 1/JA IT IG ITRM 1.0 2.0 ITSM VGKF VGKR VGAR VAK TJ Tstg 5.0 40 Amps Volts Volts Volts Volts C C Value 300 4.0 150 2.67 Unit mW mW/C mA mA/C mA Amps 1 2 3 1 2
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PUTs 40 VOLTS 300 mW
G A K
3
"50
TO-92 (TO-226AA) CASE 029 STYLE 16
PIN ASSIGNMENT
Anode Gate Cathode
*5.0 "40
-50 to +100 -55 to +150 40
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2000
1
May, 2000 - Rev. 2
Publication Order Number: 2N6027/D
2N6027, 2N6028
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient Maximum Lead Temperature for Soldering Purposes (t1/16 from case, 10 secs max) Symbol RJC RJA TL Max 75 200 260 Unit C/W C/W C
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted.)
Characteristic *Peak Current (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) *Offset Voltage (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) *Valley Current (VS = 10 Vdc, RG = 1 M) (VS = 10 Vdc, RG = 10 k ohms) (VS = 10 Vdc, RG = 200 ohms) *Gate to Anode Leakage Current (VS = 40 Vdc, TA = 25C, Cathode Open) (VS = 40 Vdc, TA = 75C, Cathode Open) Gate to Cathode Leakage Current (VS = 40 Vdc, Anode to Cathode Shorted) *Forward Voltage (IF = 50 mA Peak)(1) *Peak Output Voltage (VG = 20 Vdc, CC = 0.2 F) Pulse Voltage Rise Time (VB = 20 Vdc, CC = 0.2 F) *Indicates JEDEC Registered Data (1) Pulse Test: Pulse Width 300 sec, Duty Cycle 2%. 2N6027 2N6028 2N6027 2N6028 1 2N6027 2N6028 (Both Types) 1,4,5 2N6027 2N6028 2N6027 2N6028 2N6027 2N6028 -- IGAO -- -- -- 1,6 3,7 3 IGKS VF Vo tr -- -- 6.0 -- 1.0 3.0 5.0 0.8 11 40 10 -- 50 1.5 -- 80 nAdc Volts Volt ns IV -- -- 70 25 1.5 1.0 18 18 150 150 -- -- 50 25 -- -- -- -- VT 0.2 0.2 0.2 0.70 0.50 0.35 1.6 0.6 0.6 A Fig. No. 2,9,11 Symbol IP -- -- -- -- 1.25 0.08 4.0 0.70 2.0 0.15 5.0 1.0 Volts Min Typ Max Unit A
mA nAdc
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2
2N6027, 2N6028
IA +VB A G VAK K R2 - VS = R1 R1 V R1 + R2 B IA + VAK RG = R1 R2 R1 + R2 RG VS VF VV 1A - Programmable Unijunction with "Program" Resistors R1 and R2 1B - Equivalent Test Circuit for Figure 1A used for electrical characteristics testing (also see Figure 2) IGAO IP IV IF VA VS -VP VT = VP - VS
IA
IC - Electrical Characteristics
Figure 1. Electrical Characterization
Adjust for Turn-on Threshold VB
100k 1.0%
- IP (SENSE) 100 V = 1.0 nA + 2N5270 0.01 F R RG = R/2 VS = VB/2 (See Figure 1) R CC
+VB +V 510k 16k Vo 6V
vo 20
27k 0.6 V tf t
Scope 20 Put Under Test
Figure 2. Peak Current (IP) Test Circuit
Figure 3. Vo and tr Test Circuit
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3
2N6027, 2N6028
TYPICAL VALLEY CURRENT BEHAVIOR
1000 IV, VALLEY CURRENT ( A) IV, VALLEY CURRENT ( A) 500
RG = 10 k
100
RG = 10 k
100 100 k
100 k 10 1 M
1 M
10
5
10
15
20
5 -50
-25
0
+25
+50
+75
+100
VS, SUPPLY VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (C)
Figure 4. Effect of Supply Voltage
Figure 5. Effect of Temperature
10 V F, PEAK FORWARD VOLTAGE (VOLTS) Vo, PEAK OUTPUT VOLTAGE (VOLTS) 5.0 2.0 1.0 0.5 0.2 0.1 0.05 0.02 0.01 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 TA = 25C
25 TA = 25C (SEE FIGURE 3) 20
CC = 0.2 F
15
10 1000 pF 5.0
0 0
5.0
10
15
20
25
30
35
40
IF, PEAK FORWARD CURRENT (AMP)
VS, SUPPLY VOLTAGE (VOLTS)
Figure 6. Forward Voltage
Figure 7. Peak Output Voltage
A G
E
A P N P N K G
B2 R2 RBB = R1 + R2 R1 = R1 + R2 R1 RT A G R1 K B1 R2
+
CC
K Circuit Symbol
Equivalent Circuit with External "Program" Resistors R1 and R2
Typical Application
Figure 8. Programmable Unijunction
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4
2N6027, 2N6028
TYPICAL PEAK CURRENT BEHAVIOR 2N6027
10 IP, PEAK CURRENT ( A) 5.0 3.0 2.0 1.0 RG = 10 k 0.5 0.3 0.2 0.1 5.0 100 k 1.0 M TA = 25C (SEE FIGURE 2) 100 50 IP, PEAK CURRENT ( A) 20 10 5.0 2.0 1.0 0.5 0.2 10 15 20 0.1 -50 -25 RG = 10 k 100 k 1.0 M 0 +25 +50 +75 +100 VS = 10 VOLTS (SEE FIGURE 2)
VS, SUPPLY VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (C)
Figure 9. Effect of Supply Voltage and RG
Figure 10. Effect of Temperature and RG
2N6028
1.0 0.7 0.5 RG = 10 k 0.3 0.2 0.1 0.07 0.05 0.03 0.02 0.01 5.0 100 k 10 5.0 IP, PEAK CURRENT ( A) 2.0 1.0 0.5 0.2 0.1 0.05 0.02 10 15 20 0.01 -50 -25 100 k 1.0 M 0 +25 +50 +75 +100 RG = 10 k VS = 10 VOLTS (SEE FIGURE 2)
IP, PEAK CURRENT ( A)
1.0 M TA = 25C (SEE FIGURE 2)
VS, SUPPLY VOLTAGE (VOLTS)
TA, AMBIENT TEMPERATURE (C)
Figure 11. Effect of Supply Voltage and RG
Figure 12. Effect of Temperature and RG
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5
2N6027, 2N6028 TO-92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A H2B H2B
H W2 H4 H5 L1 L F1 F2 P2 P1 P P2 D H1 W1 W T T2 T1
Figure 13. Device Positioning on Tape
Specification Inches Symbol
D D2 F1, F2 H H1 H2A H2B H4 H5 L L1 P P1 P2 T T1 T2 W W1 W2
Millimeter Max Min
3.8 0.38 2.4 1.5 8.5 0 0 18 15.5 8.5 2.5 12.5 5.95 3.55 0.15 -- 0.35 17.5 5.5 .15
Item Tape Feedhole Diameter Component Lead Thickness Dimension Component Lead Pitch Bottom of Component to Seating Plane Feedhole Location Deflection Left or Right Deflection Front or Rear Feedhole to Bottom of Component Feedhole to Seating Plane Defective Unit Clipped Dimension Lead Wire Enclosure Feedhole Pitch Feedhole Center to Center Lead First Lead Spacing Dimension Adhesive Tape Thickness Overall Taped Package Thickness Carrier Strip Thickness Carrier Strip Width Adhesive Tape Width Adhesive Tape Position
Min
0.1496 0.015 0.0945 .059 0.3346 0 0 0.7086 0.610 0.3346 0.09842 0.4921 0.2342 0.1397 0.06 -- 0.014 0.6889 0.2165 .0059
Max
4.2 0.51 2.8 4.0 9.5 1.0 1.0 19.5 16.5 11 -- 12.9 6.75 3.95 0.20 1.44 0.65 19 6.3 0.5
0.1653 0.020 0.110 .156 0.3741 0.039 0.051 0.768 0.649 0.433 -- 0.5079 0.2658 0.1556 0.08 0.0567 0.027 0.7481 0.2841 0.01968
NOTES: 1. Maximum alignment deviation between leads not to be greater than 0.2 mm. 2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm. 3. Component lead to tape adhesion must meet the pull test requirements. 4. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. 5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. 6. No more than 1 consecutive missing component is permitted. 7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component. 8. Splices will not interfere with the sprocket feed holes.
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6
2N6027, 2N6028
ORDERING & SHIPPING INFORMATION: 2N6027 and 2N6028 packaging options, Device Suffix
U.S. 2N6027, 2N6028 2N6027, 2N6028RLRA 2N6027RL1 2N6028RLRM 2N6028RLRP Europe Equivalent Shipping Bulk in Box (5K/Box) Radial Tape and Reel (2K/Reel) Radial Tape and Reel (2K/Reel) Radial Tape and Fan Fold Box (2K/Box) Radial Tape and Fan Fold Box (2K/Box) Description of TO92 Tape Orientation N/A, Bulk Round side of TO92 and adhesive tape visible Flat side of TO92 and adhesive tape visible Flat side of TO92 and adhesive tape visible Round side of TO92 and adhesive tape visible
PACKAGE DIMENSIONS
TO-92 (TO-226AA) CASE 029-11 ISSUE AJ
A R P L
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 ---
B
K
XX G H V
1
D J C SECTION X-X N N
DIM A B C D G H J K L N P R V
STYLE 16: PIN 1. ANODE 2. GATE 3. CATHODE
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7
2N6027, 2N6028
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
NORTH AMERICA Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com Fax Response Line: 303-675-2167 or 800-344-3810 Toll Free USA/Canada N. American Technical Support: 800-282-9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor - European Support German Phone: (+1) 303-308-7140 (M-F 1:00pm to 5:00pm Munich Time) Email: ONlit-german@hibbertco.com French Phone: (+1) 303-308-7141 (M-F 1:00pm to 5:00pm Toulouse Time) Email: ONlit-french@hibbertco.com English Phone: (+1) 303-308-7142 (M-F 12:00pm to 5:00pm UK Time) Email: ONlit@hibbertco.com EUROPEAN TOLL-FREE ACCESS*: 00-800-4422-3781 *Available from Germany, France, Italy, England, Ireland CENTRAL/SOUTH AMERICA: Spanish Phone: 303-308-7143 (Mon-Fri 8:00am to 5:00pm MST) Email: ONlit-spanish@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong & Singapore: 001-800-4422-3781 Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-8549 Phone: 81-3-5740-2745 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local Sales Representative.
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8
2N6027/D


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